NM01BOND3100PKG
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NDT Systems Bondascope 3100 Portable Bond Tester Package
SKU: BOND 3100 PKG
A handheld multimode bond tester with Pitch-catch, Mechanical Impedance Analysis and Resonance modes, made for composite and bonded-structure inspection in aerospace manufacturing and maintenance.
| 3Inspection modes | 1.5 MHzMax frequency | 5.7"High-bright display | 2.26 kg5 lb with battery |
The Bondascope 3100 is a handheld bond tester used throughout the aerospace industry, relied on daily by military and commercial customers for manufacturing and in-service inspections. Using both low and high frequencies, it evaluates the most difficult composite parts, from honeycomb composites and laminates to metal-to-metal bonds.
Automatic probe recognition, alarm modes and presets for common applications let operators focus on collecting data without missing discontinuities or defects. It also works with probes from other manufacturers and can be integrated into the Bond Hub II for portable C-scan imaging.
See It in Action
Key Features
 | Three inspection modes in one handheldPitch-catch, Mechanical Impedance Analysis (MIA) and Resonance modes cover a wide range of composite and laminated parts. With a frequency range of 250 Hz to 1.5 MHz, one instrument handles honeycomb, laminates and metal-to-metal bonds. |
Flexible screen displays
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RF and impedance-plane (flying dot) displays, a time-encoded bond profile mode, a reference display, and SplitScan and SplitView let operators read results the way that suits each inspection.
Built for the Field
Automatic probe recognition
A built-in probe library recognizes probes automatically for faster setup. Standard 11-pin Fischer and 8-pin Lemo connectors also accept probes from other manufacturers.
Alarm modes and ring gates
Amplitude and phase alarms work with box, polar and up to 8 individually sizable ring gates (halo, square or ellipse) centered on stored reference points, in positive or negative operation.
High-speed swept frequency
Swept-frequency pitch-catch and MIA modes, plus a high-energy pulsed mode, help with the most challenging composite structures.
Setups and data storage
Store 100 setups and 250 screens with a real-time date and time stamp, with presets ready for the most common applications.
Portable and rugged
At 2.26 kg (5 lb) with battery and 235 × 140 × 74 mm, the Bondascope 3100 is easy to carry on the hangar floor, and ships in a Pelican-style case.
C-scan ready
The Bondascope 3100 can be integrated into the Bond Hub II portable bond testing C-scan system for imaging inspections.
Specifications
| General | |
| Manufacturer | NDT Systems |
|---|---|
| Model | Bondascope 3100 |
| SKU | BOND 3100 PKG |
| Instrument type | Handheld multimode ultrasonic bond tester |
| Shipping dimensions (estimated) | 457 × 356 × 229 mm (18.0 × 14.0 × 9.0 in) |
| Shipping weight (estimated) | 5.9 kg (13 lb) |
| Inspection | |
| Resonance mode | RF and flying dot |
| Pitch-catch mode | Tone burst with adjustable frequency, cycles and amplitude; high-energy pulsed mode; swept frequency |
| MIA mode | Fixed and swept frequency |
| Frequency range | 250 Hz to 1.5 MHz (probe and setup specific) |
| Display modes | RF impedance plane, time-encoded bond profile, reference display, SplitScan and SplitView |
| Alarms | Amplitude and phase; box, polar and up to 8 individually sizable ring gates (halo, square, ellipse); positive or negative operation |
| Probe recognition | Automatic, with probe library |
| Probe connectors | 11-pin Fischer and 8-pin Lemo |
| Physical | |
| Display | 5.7" (145 mm) diagonal, 240 × 320 quarter-VGA, high-bright EL |
| Storage | 100 setups and 250 screens, with real-time date and time stamp |
| Dimensions (H × W × D) | 235 × 140 × 74 mm (9.25 × 5.5 × 2.9 in) |
| Weight | 2.26 kg (5 lb) including battery |
| Operating temperature | -10°C to 40°C (14°F to 104°F) |
| Compatibility | |
| Probes | NDT Systems resonance, MIA and pitch-catch probes, plus probes from other manufacturers |
| Imaging | Integrates with Bond Hub II portable C-scan system |
What's in the Box
- Bondascope 3100 bond tester
- Pelican-style shipping case
- Rechargeable battery
- AC charger
- Operating manual
Standard NDT Systems package. Contents can vary by package, so contact us to confirm what ships with your order.
Complete your bond testing setup
Add the probe your inspection calls for (resonance, MIA or pitch-catch) with its matching cable. Optional accessories include a protective carry case and an external battery charger and conditioning unit.
Applications
The Bondascope 3100 is built for composite and bonded-structure inspection in aerospace manufacturing, first-article testing and in-service maintenance.
| ✓ Multi-layered laminates | ✓ Skin-to-core flaws |
| ✓ Glass and carbon fiber composites | ✓ Far-side defects |
| ✓ Honeycomb and foam cores | ✓ Impact damage |
| ✓ Metal-to-metal bonding | ✓ Adhesively bonded fittings |
| ✓ Liquid ingress | ✓ Aerospace in-service inspection |
About NDT Systems
NDT Systems has provided ultrasonic testing solutions to a wide range of industries for over 40 years. It designs and manufactures thickness gauges, bond testers, portable flaw detectors, scanners and precision transducers, and introduced the BondaScope 2100, the first impedance plane bond tester.
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